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2025年07月28日 12:43:25 No.8045 Blind and Buried Vias Fabrication投稿者 : Blind and Buried Vias Fabrication [URL] |
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Blind and buried vias fabrication specifications cover hole diameter (ranging from 0.075mm for laser – drilled micro-vias to over 0.2mm for mechanical drilling), depth based on layer thickness, and plating thickness (usually 25 – 50μm). Alignment tolerances of ±50μm are common。 |
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